Xiaomi 13 Ultra Leaked Renders Reveal A Raised Back Panel Housing Protruding Camera Module

Xiaomi 13 Ultra is confirmed to launch in China later this month. As per our previous report, the smartphone is expected to debut in the home country on April 18th. Now the upcoming flagship has appeared on leaked renders shared by reputable tipster Onleaks in collaboration with SmartPrix. The renders reveal the design of the smartphone along with some key specifications. 

As per the leaked renders, the Xiaomi 13 Ultra looks quite bulky. It has a boxy form factor with power and volume rocker buttons located on the right side. The back panel has a large protruding camera module (like the recently launched Find X6 Pro) housing four sensors and an LED flash unit. The island is missing Leica branding, however, the smartphone is already confirmed to come with the legendary camera maker’s technology. The back panel seems to be uneven as the top portion is elevated and starts to blend in with the lower portion just below the camera island. The rear panel also has curved edges. 

On the front, the leaked renders of the Xiaomi 13 Ultra reveal a curved display with a center-aligned punch-hole cutout and thin bezels. There is a speaker grille and two more cutouts, possibly for an IR Blaster and a secondary microphone at the top. The bottom of the phone houses a SIM tray, a speaker grille, and a USB-C port. 

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Onleaks says that the Xiaomi 13 Ultra will boast a 6.7-inch AMOLED curved display bearing a resolution of 2K pixels and a 120Hz refresh rate. Dimension-wise, the phone will measure 163.18 × 74.64 × 9.57mm. The upcoming offering’s White color variant is tipped to have a leather-like finish on the back panel.